Technical requirement (basic)

Layer: 2
Material: FR4/TG 135C
Material usage: DS>80%, ML>73%
Board thickness: 1.6mm
Surface treatment: Hot air levering
Solder mask: Green
Track width/gap: 0.125mm/0.125mm
Min hole size: 0.3mm
Hole density: <50K holes per squre meters
Impedance control: 50ohm +/-10%

Furthermore we are able to fulfill following requirements:

Material type: FR-4, CEM-3, Halogen-Free, High Tg, CAF material, high CTI, Rogers, Arlon, PI, BT, GETEK, PTFE
Surface treatment: HAL, OSP, ENIG, Selective ENIG+OSP, Flash Gold, Immersion Tin, Immersion Silver, Carbon Print, Peelable Mask
Solder mask: Green, blue, red, black